FPC flexible board
FPC flexible board is a kind of flexible circuit board with the simplest structure, which is mainly used to connect with other circuit boards.
PCB flexible board refers to FPC flexible circuit board. FPC flexible circuit board, also known as flexible board, is a kind of PCB with excellent flexibility. FPC flexible circuit board has the advantages of high density of wiring and assembly, good flexibility, small volume, light weight and thin thickness, simple structure, convenient installation and consistent assembly.
The performance of FPC flexible circuit board needs to be inspected by testing, including appearance test, electrical performance test and environmental performance test. FPC flexible circuit board test can be realized with the help of shrapnel micro needle module, which is conducive to improving test efficiency. It can carry up to 50A current in high current transmission, and the minimum response value in small pitch field can reach 0.15mm. Besides, it has an average service life of more than 200 thousands times, with high adaptability. Flexible board classification It is divided into Single layer flexible board ,double-sided board , double-layers board and multilayer board and etc.
Single layer flexible board structure
FPC single-layer flexible plate structure: the flexible plate of this structure is the most simple structure of flexible plate. Generally, the base material + transparent glue + copper foil is a set of raw materials, and the protective film + transparent glue is another kind of raw materials. Firstly, the copper foil should be etched to obtain the required circuit, and the protective film should be drilled to expose the corresponding pad. After cleaning, rolling method is used to combine the two. Then, the exposed pads are electroplated with gold or tin for protection. In this way, the board is ready. Generally, small circuit boards should be punched into corresponding shapes. There are also no protective film and directly printed on the copper foil solder mask, so the cost will be lower, but the mechanical strength of the circuit board will become worse. Unless the strength requirement is not high, but the price needs to be as low as possible, it is best to apply the method of sticking protective film.
Double layer flexible board structure
The structure of FPC double-layer flexible board: when the circuit is too complex, the single-layer board cannot be wired or needs copper foil for grounding shielding, it is necessary to select double-layer board or even multi-layer board. The most typical difference between multilayer and single-layer boards is the addition of via structure to connect the layers of copper foil. The first processing technology of general substrate + transparent glue + copper foil is to make via. First, drill holes on the base material and copper foil, and after cleaning, plating a certain thickness of copper, through-hole is done. After the production process and single-layer board is almost he same.
Double sided flexible board structure FPC double-sided flexible board structure: both sides of the double-sided board have pads, which are mainly used to connect with other circuit boards. Although its structure is similar to the ones of single-layer board, its manufacturing process is quite different. Its raw material is copper foil, protective film + transparent glue. First, drill holes on the protective film according to the requirements of the pad position, and then paste the copper foil. After etching out the pad and lead wire, stick another protective film with drilled hole.
According to different classification standards, PCB can be divided into the following
categories:
a. Divide by material
Phonetic resin , fiber glass /Epoxy , Polyimide, BT/ Epoxy-resin, etc.
b. Organic material
B. Inorganic materials
Aluminum, copper-invar-copper, ceramic, and so on are all of them. Mainly take its heat dissipation function
B. Distinguish between Rigid and flexible boards
a. Rigid PCB
b. Flexible PCB
c. Rigid-Flex PCB
C.In terms of structure
a. Single-sided
B. Double-sided
C. Multilayer
D. Classified by applications: communications/consumable
electronics/military/computer/semiconductor/electrical panel…
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