Thermal Paste

Short Description:

Kunshan One-part thermal paste is a thermal conductive product with lower thermal resistance and lower compressive stress. It can be realized by dispensing and applied to any shape of heat generating device with very high assembly efficiency and suitable for automated production.


Product Detail

Product Tags

★ Typical Properties of -8X20 Series Thermal Paste

Thermal Conductive Paste

Property

Unit

Product Series

Test Method

-8350

Color

 

Gray

Visual

Density

g/cc

3.1

ASTM D792

Extrusion Speed @30cc, 90psi

g/min

10-90

 

Application Temperature

-50~+200

 

Flammability Class

 

V0

UL94

Thermal Conductivity

W/m-K

3.5

ASTM D5470

Breakdown Voltage

KV/mm

>5

ASTM D149

Volume Resistivity

ohm-cm

10^13

ASTM D257

Dielectric Constant

1MHz

7

ASTM D150

★ Application

LED chip
Communication equipment,
Mobile phone CPU,
Memory module,
IGBT
Power modules,
Power semiconductor field.

★ Usage

★ Production Process

Mix Stir

Extrusion

Thermal Pad Production Line

Crop

Package

Outgoing Goods

★R&D Center

Voltage Breakdown Tester

Thermal Conductivity Tester

Kneader

Laboratory

★Features And Benefits

1.One of the standout features of this thermal paste is its excellent heat conductivity, which clocks in at an impressive 12 W/M-K. This means that it is highly effective at transferring heat from your CPU or GPU to your cooling system, ensuring optimal performance and stability for your computer.

2.Another advantage of the -8X20 series is that it is a two-component material that is easy to store. This makes it convenient to keep on hand for any future applications and allows you to use it whenever you need it.

3.This thermal paste also exhibits exceptional high and low-temperature mechanical properties and chemical stability. It can withstand extreme temperatures, both high and low, without degrading over time, ensuring optimal performance no matter the conditions.

★ Certificates


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